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  philips semiconductors preliminary specification three quadrant triacs bta208s series c high commutation bta208m series c general description quick reference data glass passivated high commutation symbol parameter max. max. max. unit triacs in a plastic envelope, suitable for surface mounting, intended for use bta208s (or bta208m) - 500c 600c 800c in circuits where high static and v drm repetitive peak off-state 500 600 800 v dynamic dv/dt and high di/dt can voltages occur. these devices will commutate i t(rms) rms on-state current 8 8 8 a the full rated rms current at the i tsm non-repetitive peak on-state 65 65 65 a maximum rated junction temperature, current without the aid of a snubber. pinning - sot428 pin configuration symbol pin standard alternative number s m 1 mt1 gate 2 mt2 mt2 3 gate mt1 tab mt2 mt2 limiting values limiting values in accordance with the absolute maximum system (iec 134). symbol parameter conditions min. max. unit -500 -600 -800 v drm repetitive peak off-state - 500 1 600 1 800 v voltages i t(rms) rms on-state current full sine wave; - 8 a t mb 102 ?c i tsm non-repetitive peak full sine wave; on-state current t j = 25 ?c prior to surge t = 20 ms - 65 a t = 16.7 ms - 71 a i 2 ti 2 t for fusing t = 10 ms - 21 a 2 s di t /dt repetitive rate of rise of i tm = 12 a; i g = 0.2 a; 100 a/ m s on-state current after di g /dt = 0.2 a/ m s triggering i gm peak gate current - 2 a v gm peak gate voltage - 5 v p gm peak gate power - 5 w p g(av) average gate power over any 20 ms - 0.5 w period t stg storage temperature -40 150 ?c t j operating junction - 125 ?c temperature 1 2 3 tab t1 t2 g 1 although not recommended, off-state voltages up to 800v may be applied without damage, but the triac may switch to the on-state. the rate of rise of current should not exceed 6 a/ m s. october 1997 1 rev 1.000
philips semiconductors preliminary specification three quadrant triacs bta208s series c high commutation bta208m series c thermal resistances symbol parameter conditions min. typ. max. unit r th j-mb thermal resistance full cycle - - 2.0 k/w junction to mounting base half cycle - - 2.4 k/w r th j-a thermal resistance pcb (fr4) mounted; footprint as in fig.14 - 75 - k/w junction to ambient static characteristics t j = 25 ?c unless otherwise stated symbol parameter conditions min. typ. max. unit i gt gate trigger current 2 v d = 12 v; i t = 0.1 a t2+ g+ 2 - 35 ma t2+ g- 2 - 35 ma t2- g- 2 - 35 ma i l latching current v d = 12 v; i gt = 0.1 a t2+ g+ - - 20 ma t2+ g- - - 30 ma t2- g- - - 20 ma i h holding current v d = 12 v; i gt = 0.1 a - - 15 ma v t on-state voltage i t = 10 a - 1.3 1.65 v v gt gate trigger voltage v d = 12 v; i t = 0.1 a - 0.7 1.5 v v d = 400 v; i t = 0.1 a; t j = 125 ?c 0.25 0.4 - v i d off-state leakage current v d = v drm(max) ; t j = 125 ?c - 0.1 0.5 ma dynamic characteristics t j = 25 ?c unless otherwise stated symbol parameter conditions min. typ. unit dv d /dt critical rate of rise of v dm = 67% v drm(max) ; t j = 125 ?c; exponential 1000 - v/ m s off-state voltage waveform; gate open circuit di com /dt critical rate of change of v dm = 400 v; t j = 125 ?c; i t(rms) = 8 a; without 3 14 a/ms commutating current snubber; gate open circuit t gt gate controlled turn-on i tm = 12 a; v d = v drm(max) ; i g = 0.1 a; - 2 m s time di g /dt = 5 a/ m s 2 device does not trigger in the t2-, g+ quadrant. october 1997 2 rev 1.000
philips semiconductors preliminary specification three quadrant triacs bta208s series c high commutation bta208m series c mechanical data dimensions in mm net mass: 1.1 g fig.1. sot428 : centre pin connected to tab. mounting instructions dimensions in mm fig.2. sot428 : minimum pad sizes for surface mounting . notes 1. plastic meets ul94 v0 at 1/8". 6.22 max 2.38 max 0.93 max 6.73 max 0.3 10.4 max 0.5 0.8 max (x2) 2.285 (x2) 0.5 seating plane 1.1 0.5 min 5.4 4 min 4.6 1 2 3 tab 7.0 7.0 2.15 2.5 4.57 1.5 october 1997 3 rev 1.000
philips semiconductors preliminary specification three quadrant triacs bta208s series c high commutation bta208m series c definitions data sheet status objective specification this data sheet contains target or goal specifications for product development. preliminary specification this data sheet contains preliminary data; supplementary data may be published later. product specification this data sheet contains final product specifications. limiting values limiting values are given in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of this specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the specification. philips electronics n.v. 1997 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. life support applications these products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. october 1997 4 rev 1.000


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